Features . Outline

SO2-12-F

　This clean oven processes 300-mm (12-inch) wafers for
　semiconductor production.
　With FOUPs, 50 wafers can be fully automatically processed
　for each chamber. The system can be used for low-
　temperature processing of polyimide and other materials.

• • Fully automatic clean oven for FOUP operation
  • Max 50 wafers per chamber
  • One robot is available for 2 chambers
  • 2 FOUPs per chamber
  • High speed wafer transfer by double wafer handling robot

CLHシリーズ

High-temperature baking in a clean environment is enabled
by the heat-resistant high-performance filter and unique
cooling unit. A hot-air circulation system is used to highly
accurately carry out wafer and glass substrate baking/aging,
polyimide curing and annealing.

• • High-temperature baking.
  • The chamber interior can maintain class 100 cleanliness
    　 (when the temperature is stable.)
  • High thermal efficiency and good temperature uniformity
  • Optimal for semiconductor wafer and glass substrate baking, aging
    　 and other heat treatments requiring high accuracy
  • Inert gases can be introduced into the chamber