Features . Outline

Heated-air Circulating Type Clean Oven
SO2-12(L)-F / SO2-30-F / SO2-60-F

　This clean oven for mass production can be used for various
　heat treatment in packaging processes, equipped with
　automatic substrate transfer mechanism supports various
　square substrates (up to 600x600mm) for chiplet and 2.xD/3D
　advanced semiconductor packaging, in addition to Φ300mm
　wafers in which we have extensive experience in polyimide cure processing of
　FO-WLP and WL-CSP.
　Low temperature processing such as polyimide curing is also available.

• • Available for heat treatment of advanced semiconductor packaging
    　 such as chiplet and 2.xD/3D
  • Compatible with Φ300mm and square substrates up to 600 x 600mm
  • Fully automatic clean oven for FOUP operation
  • Max 50 wafers per chamber
  • One robot is available for 2 chambers
  • 2 FOUPs per chamber
  • High speed wafer transfer by double wafer handling robot

High-Temperature Clean Oven
CLH-21CD(H) / CLH-35CD(H)

High-temperature baking in a clean environment is enabled
by the heat-resistant high-performance filter and unique
cooling unit. A hot-air circulation system is used to highly
accurately carry out wafer and glass substrate baking/aging,
polyimide curing and annealing.

• • High-temperature baking.
  • The chamber interior can maintain class 100 cleanliness
    　 (when the temperature is stable.)
  • High thermal efficiency and good temperature uniformity
  • Optimal for semiconductor wafer and glass substrate baking, aging
    　 and other heat treatments requiring high accuracy
  • Inert gases can be introduced into the chamber